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TPS65982 / PCB disign guide for 4-layer board

Masumi Saito
Intellectual 300 points
Other Parts Discussed in Thread: TPS65982

I recieved a question from my customer.

If you have recommended PCB design guide for 4-layer board, could you give us?

(4-layer : Signal, GND, Power, Signal)

In "TPS65982 Layout & Placement Guide", you recommend min 6 Layer as PCB structure when customers use more than 60W.

But they are going to design PCB as 4 layer if possible. In that case, they concern about whether we can dissipate heat and route pattern without affecting the performance.

So if you have reference design for 4 layer or any opinion about this issue, could you suggest to them?

Regards

Saito

  • 0
    TI__Expert 6280 points

    Hi Saito,

    Yes, this is possible but there are some trade-offs.

    • The Type-C connector will be difficult to route if you are using a full SMT mid-mount connector
    • Only 1 GND plane will not dissipate heat as efficiently (Internal)
    • Our thermal measurements were done with a 2 GND plane PCB
    • A higher Cu weight could be used to dissipate the heat
    • When supporting 60W to 100W the power routing is crucial especially when routing on an inner layer
      • There is no extra plating on inner layers
      • 100mil wide routing will get you to 3A safely
      • 250mil wide routing will get you to 5A safely

     I would follow the guide for all other items such as the amount GND vias and component placement. Are you using the internal HV or PP_EXT for the high power?