TPS65982 / PCB design guide for 4-layer board

Masumi Saito

Other Parts Discussed in Thread: TPS65982

I received a question from my customer.
If you have recommended PCB design guide for 4-layer board, could you give us?
(4-layer : Signal, GND, Power, Signal)

In "TPS65982 Layout & Placement Guide", you recommend min 6 Layer as PCB structure when customers use more than 60W.
But they design PCB as 4 layer if possible. In that case, theyt concern about whether they can dissipate heat and route pattern without affecting the performance.
So if you have reference design for 4 layer or any opinion about this issue, could you suggest to them?

Regards

Saito

over 10 years ago

0 Masumi Saito over 10 years ago

Intellectual 300 points

The customer needs your answer.RegardsSaito

0 Brian Berner over 10 years ago

TI__Mastermind 30280 points

Saito-san,

We do not at this time have a 4-Layer board design.
I will loop in an engineer who may be able to give you some pointers.

0 Masumi Saito over 10 years ago in reply to Brian Berner

Intellectual 300 points

Brian-san,

Thank you for your reply.

I'll wait for the engineer's answer.

Regards

Saito

0 Jacob Ontiveros over 10 years ago

TI__Expert 6280 points

Hi Saito,

Could you answer the following questions?

How much power is expected to be used in this system?
What type of board?
- 2 GND layers will ensure the heat gets out. On their power layer to they do a GND pour?
- What Cu weight are they using? .5oz?
Are they using the external FET path (PP_EXT) or the internal FET path (PP_HV)?
- When using the external FET path (PP_EXT) the power is dissipation is "transfered" to the external FET
Are they using an HDI process board?
- If so, they could place Vias on each of the GND pins to tie to the GND plane
Do they currently or plan to use via on pad on their board design?
- If so, they could treat the middle part of the TPS65982 as a GND slug like a power pad on a DC/DC

Jacob

Interface

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TPS65982 / PCB design guide for 4-layer board