TLK111 Thermal Pad Sizing

John,

We are looking into this and will come back to you with some information as soon as possible.

Patrick

John,

I confirmed that the example layout shown on page 41 is in error.  It will be removed in a pending update of the datasheet.

Note that we have CAD/CAE symbols for the TLK111 on the Quality & packaging tab of the TLK111 product folder.  For your convenience, the direct link is:

Hopefully these will help you in your efforts.

Patrick

Patrick,

Customer came back with another question.

I imported the CAD symbol and it is the same as what I imported from snap EDA. Im not sure if this part comes with a thermal pad or not. Based on the CAD symbols there is not, but looking at pg. 7 of SLLU186-August 2013 “aka the TLK111 Customer EVM” , it has pin 49 indicating a thermal pad (DOWN_PAD). Can you confirm with TI, if there is a thermal pad, what is the recommended pad sizing…Thanks

The parts do not have a thermal pad. Early in the development process, a package with a thermal pad was considered. Therefore, the boards were designed to accommodate this. Since a thermal pad is not required to meet the needs of the application, it is not included in the released product.

Patrick