Hello all,
We are using the TS3USB221 High-Speed switch on a board that we are developing in the VSON (QFN type) package..
Since the prototype assembly, there have been problems with the soldering of the chip on the board.
We have followed the guidelines of the SLUA271A application note regarding the footprint design as we do with all QFN packages.
Other QFNs on the same board, soldered with the same procedure, do not have a problem.
It is the TS3USB specifically that often presents symptoms of cold soldering and needs to be re-heated in order to work, not always with success.
Does anyone know of a specific solder/profile/procedure that can help to avoid such assembly failures?
Thank you,
George Giannopoulos
