TLK2711A

eli

Guru 13485 points

For PCB layout design, I need to know:

Differential lines impedance
Single ended impedance

As far as I know it should be 100 OHM differential and 50 OHM SE

But in the datasheet they wrote that the impedance is 50 OHM differential.

Thanks,

over 9 years ago

0 Luis Omar Moran over 9 years ago

TI__Genius 16150 points

Hi Eli,

Please take a look into Figure 11 and Figure 12 of datasheet. The differential characteristic impedance is 100Ohm.

Best Regards,

Luis Omar Moran

High Speed Interface

SWAT Team

0 eli over 9 years ago in reply to Luis Omar Moran

Guru 13485 points

Hi
One additional sustention:

Should I connect the Power Pad to ground or solder it to floating surface?

0 Luis Omar Moran over 9 years ago in reply to eli

TI__Genius 16150 points

Eli,

Attached you will find the Schematics of the EVM for this device, often this design is a guidance for the customers. Please check it out.

I hope this helps.

HREL002A_SCH.pdf

Best Regards,

Luis

0 eli over 9 years ago in reply to Luis Omar Moran

Guru 13485 points

Not exactly
This is a space version
The pinout is different and there is no power pad.

0 Luis Omar Moran over 9 years ago in reply to eli

TI__Genius 16150 points

Hi Eli,

Sorry for the mistake. The power pad needs to be connected to several vias according to the guideline for this requirement. Attached you will find an application report for thermal/power pad.

TI PowerPad.pdf

Regards,

Luis

0 Luis Omar Moran over 8 years ago in reply to Luis Omar Moran

TI__Genius 16150 points

The thermal pad of the TLK2711A is connected internally to the device's GND pins. It should be connected to a thermal land on the PCB that is held at ground potential. This accomplishes a dual purpose of providing a low-impedance electrical ground as well as a path for efficient removal of heat away from the die.

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TLK2711A