DP83867I Thermal Via

Ryuji

Guru 20090 points

Other Parts Discussed in Thread: DP83867E

Hello,

Are there any requirement of thermal vias on the thermal pad of QFN package?

I found that the thermal vias example on the QFP package from the datasheet P.129.
However, I couldn't found similar data of QFN package.

Best Regards,
Ryuji Asaka

over 9 years ago

0 Rob Rodrigues over 9 years ago

TI__Mastermind 19780 points

Hi Ryuji-san,

The thermal pad information for the QFN is not available yet like it is for the QFP.

Please look at the suggested footprint from the TI Altium library if possible.

Best Regards,

0 Ryuji over 9 years ago in reply to Rob Rodrigues

Guru 20090 points

Hi Rob

I can't open Altinum library. I don't have the software.
Could you please share the screen shot of the footprints?

Best Regards,
Ryuji

0 Patrick OFarrell over 9 years ago in reply to Ryuji

TI__Mastermind 31600 points

Ryugi-san,

We have a .bxl model on the Quality & packaging tab of the DP83867E product folder. This model includes schematic symbols and PCB layout footprints. The page includes a link that you can use to download and install the Ultra Librarian software which can be used to view the .bxl model.

Patrick

0 Ryuji over 9 years ago in reply to Patrick OFarrell

Guru 20090 points

Hi Patrick san,

I opend .bxl model and check the thermal via.
There are twelve vias on the thermal pad.
However, I couldn't get the size of these vias.

Could you please let me know the recommended size of thermal vias?
Is this same with QFP package (φ0.2)?

Best Regards,
Ryuji Asaa

0 Ross Pimentel over 9 years ago in reply to Ryuji

TI__Mastermind 23675 points

Hi Ryuji,

Yes, the thermal vias for the QFN should be the same that are used for the QFP.

Kind regards,

Ross

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DP83867I Thermal Via