Other Parts Discussed in Thread: TLK105
Hi!
We have the TLK105 in a design. It is connected to a processor via RMII. And we use an ethernet connector with integrated magnetics.
During EMC tests we have discovered a problem with the design and this is the observed behaviour of the design.
1. The system is up and running before test sequence start (Ethernet communication running between our design and an external switch)
2. EMC voltage transient bursts on the power supply to our system is applied for a duration of 20 seconds.
3. Sometimes ethernet communication is functional after transient burst, but sometimes the link is down after the voltage transient burst.
4. When the link is down we measure with an IR thermometer on the TLK105 device and observe that temperature is rising. (It quickly (1-2 minutes) rises from 50 degrees Celsius up to 90 degrees Celsius and the we power down the system manually.
Does anyone have any idea where to start troubleshooting the design for this kind of behaviour? I have read the documentation for the TLK105 several times and I can´t find that we have done anything incorrect in our implementation with this device, so if we can´t find a solution for this we need to change to another PHY device.