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DP83822 exposed thermal pad

g.f.
Guru 15520 points

Hi,

I have a question about DP83822 exposed thermal pad.

Should I place via against exposed thermal pad?
In DP83822 datasheet, there are no information about via for the exposed thermal pad.
But it seem that via are placed against thermal pad in DP83822 EVM.
http://www.tij.co.jp/jp/lit/ug/snlu179/snlu179.pdf

Is via for exposed thermal pad recommended?

best regards,
g.f.

  • 0
    TI__Mastermind 23675 points

    Hi g.f.,

    Thermal vias are not required, but I would recommend using vias for the dap ground.

    The 822 has very low active power so the possibility of overheating the PHY is unlikely. If you are making a multilayer board with ground planes in the stack, I would recommend using vias since it helps stitch them together and provide a lower impedance return than not having it. Also, since the dap is the only ground connection, often the vias are necessary since the pins block possible routing paths for ground.

    Kind regards,

    Ross