Hi,
I have a query regarding the thermal pad of SN65DSI85-Q1 IC. According to the datasheet the pad dimensions of thermal pad is 7.5mm x 7.5mm and soldermask opening is 3.9mm x 3.9mm. Can any body please tell me why soldermask opening is less then the pad size of thermal pad.
Your immediate response will be highly appreciated.
Regards,
Khemraj
