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Compiler/SN65LVDS31: SN65LVDS31

Olesya Shilina
Intellectual 430 points
Part Number: SN65LVDS31
Other Parts Discussed in Thread: LMH0387, SN75LVDS31

Tool/software: TI C/C++ Compiler

Dear Sirs, good morning! Would you specify the following information more detailed and give us official confirmation reply? Our organization is occupied with supply of the products with marking SN65LVDS31 and LMH0387SL of manufacturer Texas for need of the end user. We are making researches according to the programme of the end user and some inadequacies were observed during quality control:

1. There is a crystal in the body of the integrated microchip with marking SN65LVDS31. Functionality is perfect but there is other temperature range.

2. There 2 crystals inside of each hybrid integrated michrochip LMH0387SL and leads are disconnected from the crystals.

Could you comment current issue and send us official reply about these inadequacies?

  • 0
    TI__Intellectual 1635 points
    Hi Olesya,

    I'm sorry to hear that you are having some issues with the SN65LVDS31 and LMH0387. I do not fully understand the issues that you are experiencing with these devices. When you refer to the crystal(s) in the devices, are you referring to the die inside the package?

    1. What issues are you experiencing with the temperature range? This device is specified for the temperature range from -40C to +85C. Do you need a device with a larger temperature range?

    2. What issues are you experiencing issues with the LMH0387SL? What method did you use to determine that the leads are disconnected?

    Regards,
    Ryan
  • 0 in reply to Ryan Hashimoto
    Intellectual 430 points
    Dear Ryan,

    When we refer to the crystal(s) in the devices, we are referring to the die inside the package. Yes, you are right.
    1. There is a crystal with marking SN75LVDS31 in the body of the integrated microchip with marking SN65LVDS31. Microchip and crystal have different markings. What is the reason?
    2. We used X-ray examination for discovering of discarded parts.

    We are looking forward to your answer so much. Would you please give me detailed reply today?

    Sincerely,
    Olesya
    Sovtest
  • 0 in reply to Olesya Shilina
    Intellectual 430 points
    Dear Ryan,

    Could you please answer us more quickly? We need in the detailed information so much.

    Sincerely,
    Olesya
    Sovtest
  • 0 in reply to Olesya Shilina
    TI__Intellectual 1635 points
    Hi Olesya,

    Thank you for providing the additional details, this is helpful for my responses below:

    1. There is a crystal with marking SN75LVDS31 in the body of the integrated microchip with marking SN65LVDS31. Microchip and crystal have different markings. What is the reason?
    [RH] I have confirmed by looking at the bill of materials for this device, that the die that you mention is correct for this device. I can guarantee that the device number that you are using, SN65LVDS31, is guaranteed to operate over the temperature range that is specified in the datasheet (-40C to +85C).

    2. We used X-ray examination for discovering of discarded parts.
    [RH] I have reviewed the bond diagram for the LMH0387 and can confirm that there are some bond pads that do not require bond wires. Can you confirm if you were having failures due to this device?

    Regards,
    Ryan
  • 0 in reply to Ryan Hashimoto
    Intellectual 430 points

    Dear Ryan, good morning!

    Thank you for your urgent help so much. You helped us.

    Best regards,

    Olesya

    Sovtest