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DP83848YB: Thermal Characteristics of DP83848YB

Part Number: DP83848YB
Other Parts Discussed in Thread: DP83848C, DP83848VYB

In going over the datasheet for the DP83848YB there seems to be an inconsistency.  Table 5.4 shows the DP83848YB part with the LQFP package.  The ordering information shows it as the HLQFP package which has the thermal pad on the bottom of the package.  Oddly enough the thermal resistances shown in table 5.4 for the HLQFP package are worse than the LQFP which does not have the thermal pad.

It seems that table 5.4 is in error and it should show the package type HLQFP under DP83848YB.  Am I correct? 

I am using the device under extreme temperature conditions and the thermal resistance is very important to me.  I need to get it right.

Thanks

  • Hi Russ,

    The package type indicators are swapped between the DP83848C/I and the DP83848VYB/YB.

    The DP83848YB is in the HLQFP package, TI designator PTB.  The PTB package contains a thermal pad.  The thermal resistance of the HLQFP package is the lower of the two.  Only the package types are swapped.  I will note this swap for a future revision.

    Best Regards,