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TPD2S300: Layout Question

Chuchen Wang
Expert 3470 points
Part Number: TPD2S300

Hi,

My customer has the following questions: 

It looks like the GND pin is buried in the center ball of the package. Thus, it cannot be routed out using conventional "drill" vias on a PCB. Their concern is only micro laser vias can be used which will add complexity to manufacturing process, unless they tie the FLT# line to GND as well to make a path for Ground to connect.

Two questions:

1. Do have you an alternate package that uses a larger package or alternate pin-out? - does not look like other packages are available

2. If we choose not to use the FLT# pin, can I tie this pin to GND? My understanding is that FLT# will either be Hi-Z (no fault) or tied to GND (LOW) during a fault condition. Is ther an internal pullup on this pin?

Thanks,

Chuchen

  • 0
    TI__Mastermind 32711 points
    Chuchen,

    1. There is not alternate package available and this package requires a filled via that does require a laser drill.
    2. Yes this valid way to configure the part to avoid micro vias. There is no internal pull-up because the open drain fault output is intended to be level shifted to a micro controller power supply.

    Regards,
    Chuck