• State TI Thinks Resolved
  • Locked Locked
  • Replies 3 replies
  • Answers 1 answer
  • Subscribers 34 subscribers
  • Views 488 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

PCA9538: Vapour Phase and Post Build Wash

Michael Smith37
Prodigy 10 points
Part Number: PCA9538

I am using the PCA9538DGVR in a design and need to know if the component can be put through Vapour Phase and Post Build Wash.

  • 0
    TI__Guru 58120 points

    Hey Michael,

    I've reached out to our quality team to see if they know the answer to this. I'll update you when I hear back.

    Thanks,

    -Bobby

  • 0 in reply to BOBBY
    TI__Guru 58120 points
    Michael,

    Our quality engineer stated we do not qualify our devices with the Vapor Phase reflow procedure but if you follow JEDEC profile and keep the maximum temperature below 260C then there should be no problem.

    In regard to the post build wash, this is not done through the qualification process so I did not get an answer on this. I'll try to find someone else who may know and get back to you.

    -Bobby
  • 0 in reply to BOBBY
    TI__Guru 58120 points
    Michael,

    Here is the response I got back from a packing engineer:

    "By “Post build”, If customer is talking about after SMT assembly of this TI’s leaded package (SOIC or TSSOP) to their board, then we’ll need to know more about the details of their “wash” before assessing the risk (what solvent is used, time and temperature)."

    If you are able to provide me with more details, I can send him the information and let you know.

    Thanks,
    -Bobby