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HD3SS214: Reference design of application using HD3SS214 chip

Vinh Nguyen70
Prodigy 115 points
Part Number: HD3SS214
Other Parts Discussed in Thread: HD3SS213, TS3USB3031

 1/ Could somebody send me the reference design of application using HD3SS214 chip? What is the SUBSTRATE that you use for this application?

 2/ What are the parameters that need to meet the requirement of this application?
 How to test them?

I really need support for application of HD3SS214 chip. I am very grateful for everyone's help.

Thanks and regards,

Vinh Nguyen

  • 0
    TI__Guru 64326 points
    Vinh,

    I have sent the ref schematic over E2E. I am not understanding your question. Could you explain what you mean by substrate? This device is a passive which made to switch between to DP sources to one DP device or one DP source to two DP devices. What is your application? Testing can change depending on the application.
  • 0 in reply to Malik Barton57
    Prodigy 115 points
    Dear Mr.Malik,

    Thank you so much for your help.
    I am implementing the application that switch between two DP sources to one DP device.

    1/ In HD3SS213 reference design that you sent me, you use FR4-370 MATERIAL, but in datasheet of HD3SS214, some parameters are collected on a Roger material board. This make me confused.
    So I would like to know exactly what kind of material board you use for HD3SS214. Could you tell me about this?

    2/ When I layout PCB board for application mentioned above, I evaluate the characteristic parameters of high speed transmission lines, such as return loss, insertion loss, crosstalk, off-isolation, skew...
    What are the requirements for them? And how do we measure these parameters?

    Vinh Nguyen
  • 0 in reply to Vinh Nguyen70
    TI__Guru 64326 points

    Vinh,

    1/ We suggest Rogers Material board for your design but it is possible to use FR4-370 and other board materials. Board material will impact the operation of HD3SS214.

    2/ Measuring these parameters can vary based on the tools available to you. Using a Network Analyzer to analyze the trace, input and output ports would be the best way to test return loss, insertion loss, crosstalk, off-isolation, and skew. proper termination should be used (~50 ohm) on the outputs. Please refer to the TS3USB3031 datasheet section 7 (www.ti.com/.../ts3usb3031.pdf) for figures on testing these parameters. In these figures you would want the TS3USB3031 block to be the PCB traces and other devices you would like to test. 

  • 0 in reply to Malik Barton57
    Prodigy 115 points

    Dear Malik,

    Thank you so much for your reply. However, I have a problem as follows:

    Currently, I use a "HD3SS214 S-parameter Model" file that your company provided under the link www.ti.com/.../technicaldocuments to simulate the required parameters of our application.

    I realized that the information provided by this file are not completely identical to the information that provided in the datasheet of HD3SS214 chip. Besides, the information provided in "HD3SS214 S-parameter Model" file and "HD3SS213 S-Parameter Model" file (link: www.ti.com/.../technicaldocuments) are exactly alike.

    So could you please send me the exact S-parameter Model file of HD3SS214 chip? I hope I can get it to achieve the most accurate simulation parameters that I am interested. I am looking forward to receiving your support soon.

    Thanks and best regards,

    Vinh Nguyen

  • 0 in reply to Vinh Nguyen70
    TI__Guru 64326 points

    Vihn,

    Unfortunately we currently we do not have a exact s-parameter model file for HD3SS214. HD3SS213 would be the closet we have for this device.