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TUSB7320: Low temperature operation

Part Number: TUSB7320


Hi Team,

I have problem with my customers.

At low temperature (-20°C), the device will not be recognized by cold start.

Since the operating temperature range of the device is -40°C, I think that operation at -20°C is no problem.

 ・ Have the device cleared the cold start test at -20°C(or-40°C)?

 ・Do you have any advice as to why the device does not recognize at low temperature?

Best Regards,

Kenji

  • Kenji,

    Could you please give more insight into what is not being recognized, USB 2.0 or USB 3.0? Is the PCIe still working in this test?
  • Hi Malik,

    My customer's product is USB 2.0 compliant only.
    In the customer's test, it worked normally in the -10°C environment.
    I got the customer's circuit diagram and layout drawing, so will you accept it locally?

    Best Regards,
    Kenji
  • Kenji,

    Yes you can send them through E2E.
  • Kenji,

    After reviewing your documents the overall schematic seemed okay. I did notice you have pull down resistors on SDA and SCL, these should be pull up resistors, unless they are listed on another page of the schematic or a I2C EEPROM is not used.

    I would investigate the crystal operation on the non-functional boards. The crystal listed on the schematic (DSX321G) is rated for this temperature range correct? It was not obvious from the one page datasheet I was able to find but the crystal could cause issues with TUSB7320 if it fails during power up at this temperature.

    My apologies for the late response since this part is NRND there is limited support for this device.
  • Hi Malik,

    Thank you for answering.
    Unfortunately the customer confirms that there is no problem with the low temperature operation of the crystal.

    Does TUSB 7320 conduct tests on low temperature operation test before shipment?
    If you have not done the test, how do you guarantee low temperature operation?

    What should I check other than the crystal?
    I want your advice.

    Best Regards,
    Kenji
  • Kenji,

    TUSB7320 operation was characterized for this temperature range during our validation process.

    Is TUSB7320 the only part being tested at this temperature or is the whole board tested during failure? How does the temperature ramp during during failure? You may need to consider contacting your local TI representative to go through the FA process for this failure.
  • Hi Malik,

    Thank you for the advice.

    First of all, an error occurred with all the customer's products in the temperature chamber.

    Next, taken out from the the temperature chamber, blowing a freezing spray only on TUSB 7320 on the board, and confirmed to be -20°C with a thermocouple.

    (At that time, the crystal oscillator remains at room temperature)

    As a result, an error occurred.

    On the contrary, when only the crystal oscillator was set to low temperature, problems did not occur.

    Is it OK to understand that the low temperature operation confirmation is not done in the final test because the low temperature operation characteristics are confirmed at the time of design?

    I am currently asking customers to distinguish the cause of the occurrence between the device and the system.

    Based on the result, if it becomes a device factor, I will ask the TI local representative to analyze.

    Best Regards,

    Kenji


  • Kenji,

    This is correct. The records I found indicate, for this part, during our validation phase of the design cold temperature was tested and verified but final testing before shipment was only at room temperature for this device.