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DS250DF810: DS250DF810 HSK loading force

user5339841
Prodigy 10 points
Part Number: DS250DF810

Hi,

I am Jabil thermal engineer "Rex".

We have one product that will use DS250DF810 chipset and plan to mount HSK to let this chipset under spec.

So, we need to know the HSK loading force requirement. how much lb or kgf

Looking forward to your information

Thanks~

  • 0
    TI__Mastermind 19235 points

    Hi,

     

    There’s no standard industry spec or methodology for this type of testing at the BGA package device level. Empirically. TI expects the device to be able to typically tolerate 60KG of force on top of it for a few seconds.  However, TI cannot test and guarantee tolerance for any given heat sink attach method as this will be different for each heat sink and customer.

     

    TI strongly recommends that customers use a heat sink with mechanical support through their board. e.g. the heat sink should have bolts going through the board on at least two sides of the DS250DF810 retimer device.

     

    -Rodrigo