In the data sheet it states :-
"After BGA breakout, keep high-speed differential signals clear of the SoC because high current transients produced during internal state transitions can be difficult to filter out "
I have designed the HD3SS3220 to MUx directly between the Type C USB connector and a FTDI FT601 chip. How can I apply this recommendation to my scenario ??? (I don't have a relevant BGA nor Soc in my configuration )
