LMH0387: Bottom side of TLGA package

S.Satoshi

Part Number: LMH0387

Hi,

Now I'm referring the mechanical data of package in datasheet but I'm not sure if this TLGA package has themal pad or not. Please let me know which is correct as attached. Or it will be helpfull if you can send photo of actual bottom side view.

Best Regards,

Satoshi / Japan Disty

over 6 years ago

0 Michael.Walker over 6 years ago

TI__Mastermind 19720 points

Hello,
You can see in figure 11 and figure 12 of the datasheet that there is no metal pad on the bottom of the device. you can also see in the mechanical section of the datasheet that there is no metal pad on the device.

0 S.Satoshi over 6 years ago in reply to Michael.Walker

Guru 21675 points

Hi Michael,

I acutally confirm the bottom side of the device and foudn that it has green material to isolate metal pattern as attached. Can you please what's material is used for this green one? I don't need the detailed information but need only rough information to explain the customer about it.

Best Regards,

Satoshi

0 Nasser Mohammadi over 6 years ago in reply to S.Satoshi

TI__Guru* 93670 points

Hi Satoshi-San,

LMH0387 uses laminated CSP 7mm X 7mm QFN package.

Please below note a link to an application note describing this package in more details:
www.ti.com/.../snaa002e.pdf

Regards,,nasser

0 S.Satoshi over 6 years ago in reply to Nasser Mohammadi

Guru 21675 points

Hi Nasser-san,

Thank you for your response. I'll refer the Solder Resist material listed in this app note just for one example

Best Regards,

Satoshi

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LMH0387: Bottom side of TLGA package