HBM specification requires only a single + and single - event. When TI uses an HBM rating in a data sheet, does that imply that the device may fail after a second ESD strike at the kV rating in the data sheet? If so, is there any guidance as to what is an 'acceptable' repetitive ESD strike during handling or operation? Does TI provide ESD ratings to the IEC 61000-4-2 standard on some devices?
Thanks