I am working with a two companies to build a camera device. One company will design a motherboard where the main processor is located and the deserializer for the camera link. The other company will design the camera boards and module with the serializer. I have been digging through the Fourms and technical documents for a schematic and layout design guide or checklist. I found the article by Ankur Verma titled "An EMC/EMI system-design and testing methodology for FPD-Link III SerDes."
Is this the only "design guide" I can share with my third party companies to generate a schematic and layout with these chipset?
