• State TI Thinks Resolved
  • Locked Locked
  • Replies 10 replies
  • Answers 1 answer
  • Subscribers 33 subscribers
  • Views 2440 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

SN65HVD233-HT: Reliability issue with SN65HVD233HD

mael.guilbaud
Prodigy 190 points
Part Number: SN65HVD233-HT

Dear TI experts,

We have implemented the CAN transceiver in SOIC 8 plastic package (SN65HVD233HD) in one of our high temp product.
We have failures (4 parts failed on 4 tested) after 300h @ 175degC ambient temp. The transceiver is the first component of the design (500+ components) to fail.

Power supply and DSP are healty. Transceiver is used in a standard configuration (1Mbps CAN bus). It fails even not used (no CAN trafic).

Curiously, when we decrease the temperature (under 70degC ambiant), the transceiver is working back. It fails again around 100degC.

Do you have experience on such failures ? We don't understand because we seems to be in the component specification.

Best,
Maël GUILBAUD
CTO - Watt&Well

  • 0
    TI__Guru 62930 points
    Mael,
    I am not aware of any issues with this device. I will request our QA to pull reports to verify.
    Can you provide schematic?
    Was there possibility of transients on power supply during the 300hours?

    Thanks,
    Wade
  • 0 in reply to Wade Vonbergen
    Prodigy 190 points

    Hi Wade,

    Thanks for you reply.

    I can't provide you the full schematic but here is the schematic around the transceiver.

    We tried without C59 and C60, we also have failures.

    The chip fails even when there is no activity on the CAN bus during the test.

    3.3V has probably no transient (tenth of other actives, including DSP, are powered by the same power rail with no issues or failures).

    Best,

  • 0 in reply to mael.guilbaud
    TI__Guru 62930 points
    Mael,
    Can you provide the topside marking? This may be helpful in our research.

    Additionally, any potential for ground loops or large common mode voltages on the bus?

    Thanks,
    Wade
  • 0 in reply to Wade Vonbergen
    Prodigy 190 points

    Hi Wade,

    Here is the topside marking of one of the failed chips :    

    233S
    72K
    AX7RG4

    We have failed parts even on unconnected bus (ie no transient, ground loop or CM issues).

    Thanks for your help,

    Maël

  • 0 in reply to mael.guilbaud
    Prodigy 190 points

    Hi Wade,

    Did the marking help you to understand the failure ?

    Please don't hesitate to contact me in private if you wish.

    Best,

    Maël

    mael.guilbaud(at)wattandwell.com

  • 0 in reply to mael.guilbaud
    TI__Guru 62930 points
    Mael,
    Sorry for delay. There have been no issues reported for this device and we believe there to be no systematic issues with the device.
    Have you tested additional units?

    You indicated that they still fail with no activity. However, they are still connected to other drivers?

    Were parts functioning during part of the 300h test, or did they fail immediately at temp?

    I am checking one other unlikely possible cause and should have information on this soon.

    Regards,
    Wade
  • 0 in reply to Wade Vonbergen
    Prodigy 190 points

    Hi Wade,

    We haven't done other tests... It takes quite long time, and setups are currently used for other needs.

    During the test, part are not connected to a CAN bus with other drivers. They are only terminated (see the previous schematics).

    CAN buses are not monitored continuously during the test. We know that the parts worked at the beginning of the test (including at high temp).

    Thanks for your support,

    Best

    Maël

  • 0 in reply to mael.guilbaud
    TI__Guru 62930 points
    Just to follow up on this, I the other possible cause that I was looking into was confirmed to not be a cause with this material.

    Regards,
    Wade
  • 0 in reply to Wade Vonbergen
    TI__Guru 62930 points
    Mael,
    Not sure the status on your side. However, since we cannot identify an issue with the data we have I believe the only path forward would be to return devices through your distributor for analysis.
    Regards,
    Wade
  • 0 in reply to Wade Vonbergen
    Prodigy 190 points

    Dear Wade,

    We are currently running our own analysis on a failed part (including X-Rays radiography, scanning acoustic microscopy, research of delamination between plastic package and die or leads, chemical opening).

    I will update you on the results as soon as I have them.

    Best,

    Maël