Hi,
I want to route SN65DSI83 BGA chip without Via on PAD. Any suggestions?
I am planning to route the DSI signal PAD "DA3P" by removing RSVD1 Pad in BGA footprint.
The DA3P signal will be routed through Solder masked Via under RSVD1 Pad.
I just have the concern about masking resistance. Do you see any issue in this type of Fanout?
Thanks.