About DP83849I

Hi,

1. DP83849I support -40 to 85C Ambient Temperature. How does Die temperature help you here ?

2. for CLK2MAC delay : What system parameter you are trying to derive from this ? RX_CLK will be based on recovered clock.

3. If it's max, then it shall be across full temperature range ?

Regards,
Geet

Hi Geet,

I'm Kai working with Gk110.

Please let me add below comment here.

Regarding Q1, customer is looking DP83848 and DP83849I and DP83848 datasheet mentions "Maximum Die Temperature: 121.5C(Tj)" but DP83849I doesn't describe it.

Their product will be used at high temperature environment so they want to know "DP83849I Maximum Die Temperature(Tj)" to compare DP83848 thermal performance with DP83849I thermal performance.

Regarding Q2/3, they need two channel and they are worried about each channel CLK difference/ Jitter.

in order to know how much additional delay DP83848 and DP83849I cause from X1 at overall temperature range, they want to know DP83848/83849I AC Timing Requirements are supporting overall temperature range or not.

If datasheet AC Timing Requirements support only room temperature, please let us know overall temperature range of 25MHz_OUT TIMING(DP83848) and CLK2MAC TIMING(DP83849I)?

Regards,

Kai

Hi,

1. On DP83849, part is characterised for -40 to +85C ambient temperature. We can't provide Die Junction temperature as it's difficult to measure without precise temperature sensor in the Silicon. So if customer application ensures that ambient temperature on DP83849 is within the spec, it shall function as defined in datasheet.

2. This is not characterised. However we expect it to be similar to DP83848. Also, the delay is not expected to vary with temperature.

3. TI datasheet specifies min and max specifications across Temperature until unless specified otherwise.

Regards,
Geet