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TPD4E02B04: ESD TEST FAIL

Part Number: TPD4E02B04
Other Parts Discussed in Thread: ESD204, ESD224

Hi,

I have done ESD testing for my device which has a image sensor interfaced to USB bridge chip, where I have placed TPD4E02B04DQAR diode on the USB 3.0 lines. Have applied ESD spikes accordance to IEC16000-4-2 level 4. But my device get failed. On further studying related to ESD, I came to know that clamping value by TLP waveform need to be considered and need find the failure TLP voltage level of protection IC. Can anyone help me out, how to figure out the TLP failure voltage level for the protection IC. I need to make my device get pass in the ESD testing.

Thanks

Sathiya

  • Hello,

    You are correct about the clamping voltage aspect of ESD events. I would recommend you use ESD204 a device that has lower clamping and higher IEC rating

  • Hi,

    Thanks for the reply. The TLP cure values are better in the suggested part. I would like to know how to measure the TLP value of the component to be protected by the ESD diode. Is there any general thumb rule or any method to determine the TLP value of the component to be protected.

    Thanks

    Sathiya

  • Sathiya,
    The rule of thumb is that the TLP current divided by 2 is the IEC level. this means the clamping voltage at 16A TLP will be the 30ns clamping voltage at 8kV IEC61000-4-2.
    However, without running TLP on each device you will not know what the clamping voltage needs to be.
    If you would like to be more certain you could try the ESD224 which has an ultra low clamping voltage due to the series element in the device. It does mean that you have to have a discontinuous trace but if you refer to the datasheet we have a document that shows it allows HDMI2.0 dataspeeds to go through with out too much signal integrity issues.
  • Hi Cameron,

    I have searched web for the testing procedure used for TLP , but I can't able to get much information regarding this. Can you please let me know how to test a chip according to TLP to find out the clamping voltage level for that chip. Such that it will be helpful for me to find out the clamping value and thus solve my issue

    Thanks
    Sathiya
  • Sathiya,
    It is uncommon for people to do TLP themselves most of the time the chip manufacturer will have to do that. What is the chip that you are trying to protect?
  • hi,
    In my design I'm using a MCU from cypress. Unfortunately my design gets fail on ESD spikes. While studying about ESD diode i came to know about the TLP cure and its usage on diode selection.

    Thanks
    Sathiya