UCC5606: Does this device have and exposed thermal pad? TSSOP–24 (PWP)

RuggedEngie

Part Number: UCC5606

The UCC5606 datasheet shows the TSSOP–24 (PWP) package land pattern does not show an exposed thermal pad but the digikey listing shows that it does?

https://www.digikey.com/product-detail/en/texas-instruments/UCC5606PWPTR/296-29844-1-ND/2773932

over 6 years ago

0 Yaser Ibrahim over 6 years ago

TI__Genius 10250 points

Hello,

As far as I can tell, the package doesn't have a thermal pad.

Regards,
Yaser

0 RuggedEngie over 6 years ago in reply to Yaser Ibrahim

Intellectual 375 points

Thanks Yaser. I'll roll with that unless you want to investigate further?

0 Yaser Ibrahim over 6 years ago in reply to RuggedEngie

TI__Genius 10250 points

The only other thing I can do is to order a sample and check it out! You actually can order a free sample on TI web site if you wish.

Regards,
Yaser

0 Dennis McGlumphy over 6 years ago in reply to Yaser Ibrahim

Expert 1390 points

I don't what to butt in but I'm the librarian for a Mentor Graphics system and I have done a lot of footprints. After looking at the data sheet, the factory land pattern does not show a thermal pad. I would think if there were a thermal pad on the device, the land pattern would show it.

0 RuggedEngie over 6 years ago in reply to Dennis McGlumphy

Intellectual 375 points

Thanks for the info Dennis. I agree, probably best to follow the datasheet.

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UCC5606: Does this device have and exposed thermal pad? TSSOP–24 (PWP)