DS250DF410: Does ABM0101A package has collapsing or noncollapsing BGA balls?

Vijayakumar David

Part Number: DS250DF410

Could you please inform if the BGA package ABM0101A used for the device DS250DF410ABM has collapsing or non-collapsing balls?

over 5 years ago

0 Lee Sledjeski over 5 years ago

TI__Mastermind 43795 points

Hi,
The ABM0101A package is designed to have some solder ball collapse. The preferred landing pad is NSMD. See the datasheet for details.

Regards,
Lee

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DS250DF410: Does ABM0101A package has collapsing or noncollapsing BGA balls?