Hi
In one of our last POE Ethernet design, we were recommended by TI to implement the TPD4E0506DQAR TVS diode to provide ESD and CDE protection to the PHY.
We would like to note our concerns regarding the component recommended footprint, founded on the component datasheet.
when looking at the distances between the ground pads and the adjacent pads, while taking into account the tolerances, we find that for the maximum tolerances ( of both ground and adjacent pads), the remaining distance does not allow solder resist application. Leaving those distances without solder-mask may result, in our opinion, in shorts.
Please comment and recommend your solution.
Best Regards
Ohad