TUSB501: Layout check

Shu-Cheng LIN

Guru 11785 points

Part Number: TUSB501

Hi Sirs,

Sorry to bother you.

We would like to know about the TUSB501 pad suggestion map.

What is the circle of the spec center that I hope the user can handle?

1. Do not open the steel plate without anti-welding (the circle does not expose copper)
2. Do not open the steel plate, open the welding (the part of the circle is exposed)

Thank you

over 6 years ago

0 Brian Zhou over 6 years ago

TI__Guru**** 151730 points

will check with package engineer and update soon

0 Brian Zhou over 6 years ago in reply to Brian Zhou

TI__Guru**** 151730 points

can you explain more detail?

0 Shu-Cheng LIN over 6 years ago in reply to Brian Zhou

Guru 11785 points

Hi Sirs,

If reference board file (sllc463)
Just a square PAD solder mask is open, so we just follow and ignore the cross plus circle on the datasheet?

Sllc463 file

Datasheet:

0 Malik Barton57 over 6 years ago in reply to Shu-Cheng LIN

TI__Guru 64326 points

Hi,

It can be ignored, the cross plus circle is only meant to designate the center of the package.

0 Shu-Cheng LIN over 6 years ago in reply to Malik Barton57

Guru 11785 points

Hi Sirs,

Thanks for your reply.

This DRF package has a Ø0.3 drawing on the Thermal Pad, but it does not indicate its design role.
Ø0.3 Is the area to be dug? Or is it copper?
Could you help to explain why it is designed?