The datasheet for this part recommends using both external bypass caps of the RF ceramic type and the tantalum electrolytic type. It does not recommend a range of values for the tantalum electrolytic cap. Is there a guideline on how we would select which value to use in our design?
Our application is using this IC in both the 1:2 splitter and 2:1 MUX configurations. The LVDS signals we are using have a variable data rate from 2Mbps to 400Mbps.
