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TLK2711EVM-CVAL: TLK2711EVM-CVAL

tamir segev32
Prodigy 70 points
Part Number: TLK2711EVM-CVAL
Other Parts Discussed in Thread: TLK2711-SP

Hi

We are using TI obsolete parts TLK2711IRCP transceivers

We purchased TI Evaluation board TLK2711EVM-CVAL (the EVB comes with TLK2711HFG transceiver on it)

We would like to know the differences between TLK2711IRCP and TLK2711HFG transceivers

Specifically are the two part's receivers "minimum differential input voltage" identical?

Thanks

tamir

  • 0
    TI__Guru 62930 points

    Tamir,

    The two devices are created from the same base design.

    However, they are/were fabricated in different wafer fabrication facilities.

    The -SP version is in a ceramic package (HFG) and operates across a larger temperature range, and thus some slight differences in performance.

    The VID for the TLK2711IRCP was 200 to 1600mV.   It is 220 to 1600mV for the TLK2711-SP.   There is a 20mV difference in the minimum VID. 

    If this answers your question, please click "This Resolved My Issue"
    Regards,
    Wade

  • 0 in reply to Wade Vonbergen
    Prodigy 70 points

    Thanks,

    Is the different VID threshold due to different wafer fabrication facilities or different operating temperature ranges?

    Given the same conditions for both parts will the VID be the same?

    We are building a system that transmits to an obsolete TLK2711IRCP part.

    Since the only available EVBs for purchase are TLK2711EVM-CVAL we are trying to understand if working with an EVB of a TLK2711EVM-CVAL is equivalent to working with an obsolete TLK2711IRCP part.

  • 0 in reply to tamir segev32
    TI__Guru 62930 points

    I would speculate that it is primarily due to temperature range.  However the package will influence this a little as well.

    If there is some margin in the link, then there should be no issue.

    Regards,

    Wade

  • 0 in reply to Wade Vonbergen
    Prodigy 70 points

    Thanks,

    We are interested to know, given the same temperature conditions, what is the difference between the two parts VID threshold (due to package influence, different FABs, Etc.).

    Tamir 

  • 0 in reply to tamir segev32
    TI__Guru 62930 points

    These two devices were characterized independently (and many years apart), so the quantitative answer you are looking for is not possible.

    Both of their process distributions for VID should overlap.   As mentioned earlier, the ceramic package should only cause minimal degradation to the input as compared to the smaller plastic package from the commercial device.   Across voltage, temperature and process, the VID required an increase of 20mV for the Space rated device.

    Regards,

    Wade