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TPS65987D: Thermal Information

K.Yaita
Guru 29720 points
Part Number: TPS65987D
Other Parts Discussed in Thread: TPS65982, TPS65988,

Hi Team,

The datasheet shows the following about thermal information.




1)
The datasheet shows "thermal metrics are not JEDEC standard" and I believe it isn't possible to compare with another devices that are JEDEC standard. Is my understanding correct?
Is there any plan to measure with JEDEC standard?

2)
It seems ψJT is too larger value. Is the value correct?
For example, ψJT of TPS65982 is 0.3 C/W.

Best Regards,
Yaita

  • 0
    TI__Mastermind 36756 points

    Hi Yaita-san,

    1. There are no plans to measure with JDEC standard for TPS65988. The thermal measurements are based on the TPS65988 evaluation board. You can read the application note in point (1) for more information on the measurements.

    2. TPS65988 is in a QFN package while TPS65982 is in a BGA package so it is difficult to compare the thermal performance. For TPS65988, the most important measurements are the Junction to case measurements for the GND pad and the Drain Pads. The Drain pads will conduct most of the heat through the PCB as that is where the two power paths of the TPS65988 connect to the PCB.

    Thank you,
    Eric

  • 0 in reply to Eric Beljaars
    Guru 29720 points

    Hi Eric-san,

    Thank you for your support. I understand.

    By the way, the following table is from TPS65987D datasheet (not TPS65988).
    Is the following "TPS65988" of red line typo? 



    Best Regards,
    Yaita

  • 0 in reply to K.Yaita
    TI__Mastermind 36756 points

    Hi Yaita-san,

    The thermal simulations for both TPS65987D and TPS65988 were done using the PCB layout of the TPS65988EVM.

    Thank you,
    Eric