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SN55LVDS33-SP: Die comparison with SN65LVDS33

Steve Widener
Genius 11010 points
Part Number: SN55LVDS33-SP
Other Parts Discussed in Thread: SN65LVDS33, , SN65LVDS31, SN55LVDS31-SP

Does the the SN55LVDS33-SP use the same basic die (albeit with different processing, packaging, testing and specifications) compared to the SN65LVDS33?

Same question for the SN55LVDS31-SP and the SN65LVDS31

  • 0
    TI__Guru 62930 points

    Steve,

    TI cannot share wafer, die and process details specific to any device, as this information is proprietary. Typically there are differences between space and non-space devices (including mil and EP grade products). These differences can be in the form of process, layout, or design changes. These are done to improve radiation performance of space device. Please note that radiation performance for a non-space device can be significantly worse compared to space qualified device even though electrical performance is identical. In addition there are several factors on non-space device that makes it risky for space applications. Some of important factors:

    -          No single controlled baseline: Translates to high variability of radiation performance (commercial products)

    -          Mostly use copper bond-wire: May not be reliable for space environment (commercial products)

    -          No testing for radiation at lot level: High risk of getting devices that have poor radiation level (non-space products)

    If this answers your question, please click "This Resolved My Issue"
    Regards,
    Wade