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TUSB542: Layout guidelines confirm

Part Number: TUSB542


Hello, we have 2 questions about the layout guidelines of TUSB542 datasheet.

1. Intra-pair routing should be kept to within 2 mils;

2. Route all differential pairs on the same layer.

 

As for question 1.

we found Intra-Pair skew requirement in "High speed layout guide.pdf"  to be 5mils. So which one is true?is it  actually so strict for 5Gbps?

And is the Max Intra-Pair skew requirement applied to all 6 differential pairs?


 

As for question 2 :

Should all 6 differential pairs be routed on the same layer?(RX_AP+/-, TX_AP+/-, Rx_Con_1+/-, Tx_Con_1+/-. Rx_Con_2+/-, Tx_Con_2+/-)

It is hard to realize.

  • Hi,

    Question 1: For TUSB542 specifically the 2 mil standard should be followed. The recommendation from the High speed layout guidelines is a general recommendation for USB 3.x applications. This requirement is meant to perverse SI of the high speed USB signals and provided the best performance.  

    Question 2: It is preferred to have all diff pairs routed on the same layers to avoid the use of vias (through-all and mirco) for the best SI. If required a minimum number of vias should be used.