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TCAN1051-Q1: What would happen if there is no via for thermal PAD of VSON package?

Yoshikazu Kawasaki
Expert 3510 points
Part Number: TCAN1051-Q1

Hello,

My customer is wondering what would happen if there is no via for thermal PAD of VSON package.  The datasheet shows vias for VSON package.  I know it's required for QFN and SON packages with high power dissipation devices, but TCAN1051-Q1 shouldn't have that much, so please tell me about it.

Best Regards,

Yoshikazu Kawasaki

  • 0
    TI__Guru 62910 points

    Kawasaki-san,

    The only benefit of the vias in improved thermal coupling to the PCB.  You are correct that during normal operation the power dissipation within a CAN transceiver is not too high, though, and so in most cases this coupling is not critical.  If the vias are omitted, you may want to double-check the solder stencil dimensions used to ensure manufacturability (i.e., in case the solder stencil referenced was sized based on the expectation that solder wicking may occur down the vias).

    Regards,
    Max

  • 0 in reply to Miguel Robertson
    TI__Expert 3510 points

    Hello Max,

    Thank you for your comments,  I understand the vias can be omitted if the customer's PCB doesn't based on the expectation of solder wicking/expanding down the vias.

    Best Regards,

    Yoshikazu Kawasaki