Hi Experts,
My customer facing pin2 short to ground, they will unsing x-ray to take picture tomorrow. But they want to know why the recommend PCB footprint pad size is equal to chip pad size.
By there knowledge they think the pcb pad should bigger than chip pad , is it right? Do you have suggestion for footprint , or could you give some advice. Thanks
Hi Jeff,
The solder looks horrible it may not have been properly applied during reflow. Based on the picture most of the pins did not get soldered correctly.
I would recommend to check the stencil as a first step.
Regards,
Lee
Hi Lee,
As below e2e thread,the package is pull-back terminal end type of SON,the side exposed copper do not need to solder. Customer is following TI
recommand footprint, the PCB pads are totally under the chip,in customer's board we can see many indium ball on the side I think it mabye too much solder
paste. As above your answer , I think the "no solder" is expected because the solder not rely on side copper but is rely on buttom pad. The "PARTIAL
SOLDER" is indium ball on the side. The"Good" is just look like good but in practice is not good ,because under of the solder point is solder mask not pad
on pcb.
Thanks.
Hi Lee,
Below is x-ray picture, we can see pin1/pin2 are shortage. We think that is because too much solder paste . Customer want to know whether or not ti have suggestion stencil thickness and the dimension of the stencil opening size for this package.
Thanks
