Is there a recommended bypass capacitance scheme for this chip? It seems to not have one specified inside data sheet.
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Is there a recommended bypass capacitance scheme for this chip? It seems to not have one specified inside data sheet.
Zach
0402 surface mount capacitors should be used to minimize package inductance of capacitors. Each bypass capacitor should be connected to the power and ground planes through vias tangent to the pads of the capacitor. An array of different capacitor values such as 100 pF, 1 nF, 0.03 µF, and 0.1 µF are commonly used in parallel as the bypass capacitance.
Thanks
David
For this device two 0.1uF capacitors are enough for decoupling. Use one 0.1uF for each cluster of VDD pins.
Regards,
Lee