Team,
We manufactured our board slightly incorrectly to TI’s recommended layout and left soldermask covering the center exposed pad “DAP GND”. What are the performance degradations, if any, if we do not connect the center exposed pad to ground and left it floating?
Is the single ground pin sufficient?
As a note, we only plan to use this up to 130MHz in this application.
As a fallback can we just scrape away the soldermask to allow for the solder connection to the center pad?
Thank you.
