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TFP401A-Q1: Thermal characteristics

Nir Flysher
Expert 3287 points
Part Number: TFP401A-Q1

Dear Team,

can you please advise on my customer's question below :

I am interested in the package thermal resistance ΘjC_top and ΘjC_bottom [°C/W]

The data sheet addresses the component thermal characteristics in two different tables:

    1. In the Thermal Information table (page Page 6) the internal thermal resistance is 12.3 [°C/W] and 7.3 [°C/W], respectively.
    2. In Table 1. Page 15 the ΘjC=0.12 [°C/W] for Power PAD package (pad connected to thermal plane) 
      

      

      

      Which table is correct ?
      

      

      Best regards,
      Nir
      

      3. 

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                          TI__Mastermind
                        35130 points
                      
    
                          
                   		
		
    
					
    HI Nir,
    

    The PowerPAD package gives thermal metrics for specific conditions (PCB plating, airflow, etc). You can use these metrics if the device is mounted on the PCB with the conditions it specifies in section 10.3. Otherwise, you use the thermal information provided on page 6.
    

    Regards,
    

    I.K. 
    
			
    

		
		
		
		
	
    
	
    
		
    
			
		
    
	
    

	            
                 	
	
    
				
		                
                
                
                
                
                
                
        		
		
				
    
			
		
    
		
		 
		
		
     
    
	
    

    
			
    
			
    
		
    

		
    
	
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