Hello,
Can u pls. advise for the PCB layout for the LMH1297.
My PCB stuck-up is :
1-CS. Signal
2. Ground/Power Plane
3. Signal
4. Ground/Power Plane
5. Signal
6. Ground/Power Plane
7. Signal
8. Ground/Power Plane
9. Signal
10. Ground/Power Plane
11. Ground/Power Plane
12. Signal
13. Ground/Power Plane
14. Signal
15. Ground/Power Plane
16. Signal
17. Ground/Power Plane
18. Signal
19. Ground/Power Plane
20-PS. Signal
I planning to place the LMH1297 on the print side (layer 20) and rout the 75 Ohm signals (SDI_IO+/-) on layer 20, making a void under them at layer 19 and 18, and use layer 17 as a reference Plane for the 75 Ohm traces,do u recommend it?
Also, is it OK if I use layer 18 as reference plane, for the 75 ohm traces at layer 20 ? I am planning to do so by creating a void at layer 19 and implement a small plane area under the 75 Ohm traces, at layer 18 that will be connect it to ground layer 19 by VIAS).
Best regards,
Emanuel