TLK2711-SP: TLK2711-SP

karthick s1

Part Number: TLK2711-SP

Small mistake has happened in our design while creating the foot print in RPB board (LRDE).Can we cut the pins with boarder and mount the component to matching with our board foot print pins. let me know if we cut the pins will affect the functionality of the device. Kindly give the confirmation on the same.i have attached snapshot of board and device footprint.

over 5 years ago

0 Rodrigo Natal over 5 years ago

TI__Mastermind 19235 points

Hi. The modification is worth a try, but I cannot guarantee that it will work.

regards,

Rodrigo Natal

0 karthick s1 over 5 years ago in reply to Rodrigo Natal

Prodigy 20 points

Hi,

Kindly check once again and give the confirmation. because this device is very costly.

Shall we try it or not?

Regards

Karthick

0 Akshat Garg over 5 years ago in reply to Rodrigo Natal

TI__Intellectual 1040 points

Hi Rodrigo,

I believe the customer has to cut the border in the package. Without cutting they cannot use the IC. Can you please confirm with Richard Biddle on this ? Even the EVM pic does not have any borders.

http://www.ti.com/tool/TLK2711EVM-CVAL

Regards,

Akshat

0 Rodrigo Natal over 5 years ago in reply to Akshat Garg

TI__Mastermind 19235 points

I've double checked internally. The customer is responsible for trim and form. See below:

Hermetic surface mount packages are typically sold non-formed as most customers have a preferred final form factor which can vary from customer to customer. Some use the default form factor available from third party service providers such as Fancort or Corfin. Fancort maintains a library of form factors on their website at www.fancort.com/Standard-SMT-Footprints.aspx for reference. Fancort can also provide a lead-forming service or sell the fixtures for a customer to form in house. General information is found at http://fancort.com/Products/Lead-Forming-Services.aspx. TI does not endorse or recommend these companies but only mentions them as example service providers.

Cordially,

Rodrigo Natal

0 Wade Vonbergen over 5 years ago in reply to Rodrigo Natal

TI__Guru 62930 points

I would like to add, that the image provided shows the device dead-bug.

The device needs to be mounted live-bug with the symbol/lid on the top. This allows the thermal pad/gnd to be attached to the board.

The lead form process will do this. Also, the lead forming that will be defined will need to match the landing pattern of your board.

Regards,

Wade

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TLK2711-SP: TLK2711-SP