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DS160PR410: Sharing VIA hole of thermal pad in double-side mounting

Katsu Matsunaga
Expert 7730 points
Part Number: DS160PR410

Hi,

 

I would like to confirm layout of this device in double-side mounting.

Due to space limitation, two DS160PR410 will be located both side of board.

 

In this case, is it possible to share the via hole of thermal pads between two devices?

The via will be connected with four GND layers

 

In addition, does this apply device in the same series?

 

Best regards,

Katsu

 

  • 0
    TI__Mastermind 43795 points

    Hi Katsu-san,

    Yes it is okay to share the thermal via holes.  Since there are multiple GND layers the heat from each device will have plenty of plane area to dissipate.

    Yes even if the devices are not the same redriver part number it is okay to use common thermal vias.

    Regards,

    Lee