DP83TC811R-Q1: Number of Vias

Isee

Expert 6610 points

Part Number: DP83TC811R-Q1

DP83TC811R has five vias at ground plane - is that needed for better heat dissipation or any other reason?

Can those vias also be implemented as microVias, would you need more than five then?

Overall the concern is that vias underneath the ground plance could result in problems when soldering.

Regards

Andreas

over 5 years ago

0 Cecilia Reyes over 5 years ago

TI__Genius 9920 points

Hi Andreas,

The five vias are for heat dissipation and ground connection from pins as well as across ground layers. I'm not sure what you mean by implementing as microvias, can you explain more?

Thanks,

Cecilia

0 Isee over 5 years ago in reply to Cecilia Reyes

TI__Expert 6610 points

The microvias dimensions are 300µm Restring and 100µm laser-drilled - would that be possible and if yes, how many are needed and where? thx, Andreas

0 Cecilia Reyes over 5 years ago in reply to Isee

TI__Genius 9920 points

Hi Andreas,

I will have to discuss with the internal team and confirm the amount.

Thanks,

Cecilia

0 Isee over 5 years ago in reply to Cecilia Reyes

TI__Expert 6610 points

Any news? Regards, Andreas

0 Cecilia Reyes over 5 years ago in reply to Isee

TI__Genius 9920 points

Hi Andreas,

Apologies on the delay I will need one more day to review with the team.

Thanks,

Cecilia

0 Cecilia Reyes over 5 years ago in reply to Cecilia Reyes

TI__Genius 9920 points

Andreas,

I spoke to my internal team about this and the 5 vias were selected per the analysis and decision of our packaging team. I am still trying to understand your need for these to be microvias now instead of the standard recommendation.

I am looping in our packaging team to see if they have an analysis on the microvias but I think I will need further understanding.

Thanks,

Cecilia

Interface

Interface forum

DP83TC811R-Q1: Number of Vias