SN55LVCP22-SP: Thermal resistance

Also, our customer would like to know if the thermal resistance of this device has been analyzed through finite element analysis or tested thermally in a vacuum chamber to see the resistance without an air gap? They're concern that it includes dissipation to ambient air and dissipation through an air gap to the board.

I did saw junction-to-board thermal resistance in the datasheet, it's not the one you are looking fir?

Hello Brian,

Thank you for looking into this. The datasheet contains the thermal characteristic for theta JA and theta JC, our customer is looking for theta JB.

Regards,
Carlo

sorry, I may look at the wrong device. I submit request for this data, but need couple days to get it.