SN55LVDS31-SP: package information required for thermal analysis

ashok kumar3

Part Number: SN55LVDS31-SP

For thermal analysis of SN55LVDS31-sp , we need following information:

· Weight

· Component core material

· Component package material

· Metal lid material

· Metal lid coating

· Surface color of package (other than metal lid)

· IR emittance of package

· Pin lead core material

· Pin lead coating material

· Is metal lids (@ top and/or bottom) are electrically grounded.

· Is .stp or .step file available for these packages?

0 Ikechukwu Anyiam over 5 years ago

Hi ashok,

I'll see if I can get this information for you and will update this thread accordingly.

Regards,

I.K.

0 Ikechukwu Anyiam over 5 years ago

Hi Ashok,

Please see below answers from our packaging team:

Weight
~ 0.5 grams
Component core material
Not sure what this question is referring to
Component package material
Ceramic
Metal lid material
Not applicable, ceramic lid
Metal lid coating
No coating, ceramic lid
Surface color of package (other than metal lid)
Brown
IR emittance of package =
No
Pin lead core material
Alloy 42
Pin lead coating material
Solder 63Sn/37Pb
Is metal lids (@ top and/or bottom) are electrically grounded?
Not applicable, ceramic lid
Is .stp or .step file available for these packages?
No

Regards,

I.K.

0 ashok kumar3 over 5 years ago in reply to Ikechukwu Anyiam

Hi,

thanks a lot for sharing the information.

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