TFP401A: T_J

Hi Barrett,

Please see here: https://e2e.ti.com/support/interface/f/138/p/455397/1641042#1641042

Regards,

I.K.

Hi IK,

Thanks for the quick response. I don't think the answer to the post you link is correct. T_J abs max is a constant that is dependent on each device and is independent of application / design. The thermal metrics are used to estimate actual T_J in order to ensure it stays below absolute max specced in datasheet (including some margin). Since our TFP401A datasheet is missing T_J abs max, the thermal metrics can't be used to ensure SOA for a specific pcb layout across all operating conditions. Here's an example from our TLV1805 comparator datasheet:

Hi Barrett,

Tj max is not a datasheet spec for this device, and will require Si node, qualification, and reliability testing to determine. Since that has not been done for this device you can use the previously linked E2E post to approximate it. There is also an FAQ you can reference here: https://e2e.ti.com/support/switches-multiplexers/f/388/t/167939

Regards,

I.K.

Hi Ik,

Estimating T_J as described in Adam's post that you linked isn't the problem here. It's what to do with T_J after we estimate it. Adam stated the following for TS5A21366:

"113.3°C is an approximation of the maximum junction temperature that the device can obtain while operating at its maximum recommended values.  The datasheet abs max table states that max storage temperature for the device is 150°C which is well above 113.3°C.  This will mean that there is little risk of thermally causing damage while running this part to its maximum recommended values."

Would it be safe to make the same assumption for TFP401A and use max storage temperature as T_J max? If not, can we do this:

"Si node, qualification, and reliability testing to determine."