Please help us find the parameter Tj for TEXAS INSTRUMENTS TLK1521IPAP
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Hi,
Please refer to thermal table below from TLK1521 datasheet. The junction to ambient thermal resistance can be calculated by taking inverse of the derating factor.
DISSIPATION RATING TABLE
PACKAGE |
TA ≤ 25C POWER RATING |
DERATING FACTOR† ABOVE TA = 25C |
TA = 70C POWER RATING |
PAP64‡ |
3.22 W |
32.15 mW/C |
1.77 W |
PAP64§ |
0.94 W |
9.46 mW/C |
0.52 W |
PAP64¶ |
0.68 W |
6.78 mW/C |
0.37 W |
† This is the inverse of the traditional junction-to-ambient thermal resistance (RJA)
‡ High K-board with solder
§ High K-board without solder
¶ Low K-board
NOTE: For more information, see the TI application note PowerPAD Thermally Enhanced Package, TI (SLMA002).
Regards,
Rodrigo Natal
Dear Rodrigo,
Can you or anyone on the team please advise the thermal parameters of the device ? (Tjunc_max, Teta_JC, Teta_JA, etc)
This is needed for thermal simulation.
Best regards,
Nir
HI Nir,
I unfortunately do not have additional thermal info beyond what is included on the datasheet.
Cordially,
Rodrigo Natal
HSSC Applications Engineer