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TLK1501: TLK1521IPAP Tj

Part Number: TLK1501

Please help us find the parameter Tj for TEXAS INSTRUMENTS TLK1521IPAP

  • Hi,

    Please refer to thermal table below from TLK1521 datasheet. The junction to ambient thermal resistance can be calculated by taking inverse of the derating factor.

    DISSIPATION RATING TABLE

    PACKAGE

    TA 25C POWER RATING

    DERATING FACTOR† ABOVE TA = 25C

    TA = 70C POWER RATING

    PAP64‡

    3.22 W

    32.15 mW/C

    1.77 W

    PAP64§

    0.94 W

    9.46 mW/C

    0.52 W

    PAP64¶

    0.68 W

    6.78 mW/C

    0.37 W

    † This is the inverse of the traditional junction-to-ambient thermal resistance (RJA)

    ‡ High K-board with solder

    § High K-board without solder

    ¶ Low K-board

    NOTE: For more information, see the TI application note PowerPAD Thermally Enhanced Package, TI (SLMA002).

     

    Regards,

    Rodrigo Natal

  • Dear Rodrigo,

    Can you or anyone on the team please advise the thermal parameters of the device ? (Tjunc_max, Teta_JC, Teta_JA, etc)

    This is needed for thermal simulation.

    Best regards,

    Nir

  • HI Nir,

    I unfortunately do not have additional thermal info beyond what is included on the datasheet.

    Cordially,

    Rodrigo Natal

    HSSC Applications Engineer