Could somebody please provide to me thermal performance data for the subject part? Specifically theta-J/B, theta-J/C, and max junction temperature. Thanks in advance
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Which specific part number? Theta J/B and J/C depend on the package of the device i.e. SOIC or PDIP package.
Regards,
Greg
Hello Erwin,
The SOIC package is only available in the commercial temperature range of 0C to 70C.
The generic data for 16 pin D is J/B=18.25C/W using a High K model and J/C=38.4C/W using a Low K model. I have requested data specific to the AM26LS32ACD be generated and I will post the results when complete.
The data sheet parameters are guaranteed up to Tj=70C; The device will operate at higher temperature, but there is no specification for performance above 70C.
Regards,
Ron M.
"The device will operate at higher temperature, but there is no specification for performance above 70C."
This is a concern when we look in the data sheet, I see the maximum “free air temp” is 70C … this is a lot different from junction temperature. Can you clarify?
Hello Erwin,
Production and failure analysis high temperature testing will be performed at 70C. The test time is short, so Tj will be nearly Ta during testing.
Regards,
Ron M.
Regarding: "The generic data for 16 pin D is J/B=18.25C/W using a High K model and J/C=38.4C/W using a Low K model. I have requested data specific to the AM26LS32ACD be generated and I will post the results when complete." The packaging group confirmed the original numbers reported. Regards,
Ron M.