DP83822I: Any suggestion to pattern design for better heat dissipation ?

Hung Ching Hsu

Expert 3086 points

Part Number: DP83822I

Hi Team

My customer is using DP83822I and concerning the heat dissipation.

They are thinking improve it by pattern design.

For now, they had 5 vias(center and four corners) on exposed pad of DP83822I,

is there any suggestion to pattern design for better heat dissipation ?

Also, they are thinking downsizing the resistor around DP83822I to have more surface space, and use the

space as GND solid pattern, is there any other element (i.e. pin) contributes to heat dissipation besides exposed pad?

And does it work for heat dissipation if they place GND in surface layer by connecting via of exposed pad

through GND solid pattern of inner layer ?

Thanks.

over 5 years ago

0 Vikram Sharma over 5 years ago

TI__Genius 16030 points

Hello Hung,

You are in the direction and we need to work on exposed pad only. But we dont have any reference design for this. Also we dont have data on how much will be the improvement of connecting additional ground plan via vias.

Regards,

Vikram

0 Hung Ching Hsu over 5 years ago in reply to Vikram Sharma

TI__Expert 3086 points

Hi Vikram

Thanks for your reply. I'll let you know if the customer have further question about it.

BTW, what do you mean by "You are in the direction"? Is there any missing word?

Thanks.

0 Hung Ching Hsu over 5 years ago in reply to Vikram Sharma

TI__Expert 3086 points

Hi Vikram

My customer has another question about vias on the exposed pad.

As i mentioned, they had 5 vias(center and four corners as "X" mark) on exposed pad of DP83822I,

and the vias on exposed pad shown in datasheet also have 5 vias but more like "+"mark.

So the customer is wondering if there any data showing which type is better for heat dissipation.

In other words, should the customer put vias with "+" mark as shown in datasheet instead of "X" mark or there's no difference?

Thanks.

0 Hung Ching Hsu over 5 years ago in reply to Vikram Sharma

TI__Expert 3086 points

Hi Vikram

May I have your comments for the questions from the customer?

Thanks.

0 Vikram Sharma over 5 years ago in reply to Hung Ching Hsu

TI__Genius 16030 points

Hello,

I found the following app note giving guidelines for board design for thermal resistance :

I could not find any specific data to help for different via position + extra vias to burried plane. Also I searched but could not find any type of vias differentiated by x or + so it must the representantion of the same via.

Regards,

Vikram

0 Hung Ching Hsu over 5 years ago in reply to Vikram Sharma

TI__Expert 3086 points

Hi Vikram

The figure in p.13 helps!

Thanks for your information.

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DP83822I: Any suggestion to pattern design for better heat dissipation ?