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TCAN1043-Q1: Thermal pad and sleep mode

Amelie Zheng
Genius 10865 points

Part Number: TCAN1043-Q1
Other Parts Discussed in Thread: TCAN1043,

Hi team,

May I ask the the following question?

  • Do the thermal pad need to connect to GND？

  • If customer use a 3.3V to 5V boost power supply for VCC, that is, when the input drops below 4.5V, the VCC and VIO power supplies of the TCAN1043 are both normal, and only VSUP becomes below 4.5V. What will happen? Does it affect the normal operation of the CAN transceiver?
  • How could CAN get into sleep mode？

  • 0
    TI__Guru 74372 points

    Amelie,

    You may ask whatever questions you like, and thanks for bringing these to E2E.

    • The thermal pad is meant to be essentially a heat sink connection for the transceiver. While the thermal pad internally has no connection to GND on the IC, typically on PCB the GND net is the largest copper pour, and thus the best net for dissipating any heat generated by the IC. So in the majority of use cases, the thermal pad is connected to GND on the PCB, however, it is not a requirement for the device to function correctly.
    • The device will behave normally until it falls below 4.2V on VSUP. At this point, the device will go into a protected state where the bus pins will no longer drive communication to the bus. The transceiver will essentially act as if it is in sleep mode. You can find a table in the TCAN1043-Q1 datasheet on page 25 describing this.
    • On page 27 of the datasheet there is a state diagram describing all the modes of the transceiver and the methods of transitioning in and out of these modes. For sleep mode, you can either assert a logic high on EN and a logic low on STB for longer than tgo-to-sleep, or an undervoltage condition occurs on VIO and/or VCC for longer than tuv.

    Please let me know if you have any other questions.

    Regards,