For the TLK10031 low and high speed interfaces, the layout guidelines (Chapter 10) in the datasheet state "Differential intra-pair skew needs to be minimized to within ±1 mil.". Does this rule take into account the bond wire lengths inside the TLK10031 package? Or do I need to include the bond wire and PCB trace lengths in the 1 mil skew calculation? Is bond wire length data for the TLK10031 available?